TY  - BOOK
AU  - Lau ,John H.
TI  - Flip Chip Technologies
SN  - 70366098
U1  - 621.381046 LAU 
PY  - 1996///
CY  - New York
PB  - Mc Graw HIll
KW  - Electronic Engineering
KW  - Technology
N1  - Includes Index
ER  -